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The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage
from the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlife
exposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary to
avoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedure
and JEP113 defines the labeling requirements.
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